19" panel 1 HE for 16 x D-type connectors
$243.80*
SYSPAN-D
Advantages:High packing density on 1 RUFlexible, fast equippingSubsequently alterable and thus future-proof
19" panel for 5 x SYFB 21 / SYCFB 21-panels, 1HU, depth 140 mm
$247.25*
SYSPAN5
The SYSPANEL5 allows the fast and easy construction of patch panels, device connection panels, connection distributors or transfer points, e.g. in control or equipment rooms.The SYSPANEL5 can be fitted with up to 5 SYSBOXX front panels (1 width unit / WU), SYFB21-…) or 5 SYSBOXX docking modules (1 width unit / WU), SYC1-…), thus enabling the realization of modular 1 RU connection panels with a flush-mount module integration into the housing front.As a strain relief for the feed lines, the case holds 28 metal tongues for attaching cable ties. The case earthing is provided by an M4 ground screw (PE).The individual lettering can be done using our SYSBOXX labeling profile. Optionally the SYSPANEL can be closed from above with the cover (SYSPAN-C).The labeling profile as well as the frontpanels/docking modules are fastened in a time-saving manner with self-tapping M2.5 Torx screws.Advantages:High packing density on 1 RUGreat variability due to a wide selection of front panels (e.g. for building a connection panel for media servers)Flexible, fast equippingSubsequently alterable and thus future-proof
Connector Module 4 x NEUTRIK® etherCON® NE8 B-series on LSA clamp (4x2x4-pin), 8-pole , 1 HE, 3 BE, metal-, LSA-clamp (white) 32 x-, gold plated contact(s), nickel, for SYS-series
$173.65*
SBC13-EBL
This connector module for use in SYSBOXX, SYSPAN or SYSBOARD housing systems provides an easy and high-quality installation option for combining the popular NEUTRIK® etherCON® series with other common AV and media technology connector systems. This enables a trouble-free combination of connection systems for network, media and audio technology as well as power supply. The insulation displacement connectors are tried and tested LSA+ modules from manufacturer ADC KRONE and suitable for cables with solid wires from AWG 27/1 to AWG 22/1 or stranded wires with AWG 24/7. For shield connection and strain relief metal cable clamps are included in delivery. The circuit board is optimized for signals up to a maximum of 100 MHz (max. 1Gbit/s).
SYSPANEL housing 19” with 16 x A / B press cut for 4 x SBC13-modules , 1 HE; depth: 140 mm
$243.80*
SYSPAN
In the SYSPAN only SYSBOXX modular boards can be fixed. The assembly of connectors in the classic "D-size“ is not possible.
19" panel for 5 x SYFB 21 / SYCFB 21-panels, 1HU, depth 230 mm
$207.00*
SYSPAN5-XL
The SYSPANEL5-XL allows the fast and easy construction of patch panels, device connection panels or transfer points, e.g. in control or equipment rooms.The SYSPANEL5-XL can be fitted with up to 5 CARDINAL DVM 1 WU units (e.g. DVM-SYS-DIS, DVM-SYS-DISH, DVM-HDF4-FIBER-over-HDMI® or also SYSBOXX SYKP cassette profile), 5 SYSBOXX front panels (1 WU, SYFB21-…) or also 5 SYSBOXX connection modules (1B, SYC1-…), thus enabling the realization of modular 1 RU connection panels. The large housing depth also allows an easy integration of extender systems or format changers. The module fronts are integrated flush-mount into the housing front.As a strain relief for the feed lines, the case offers 28 metal tongues for attaching cable ties. The case earthing (PE) is provided by an M4 ground screw.The individual lettering can be done using our SYSBOXX labeling profile. Optionally the SYSPANEL can be closed from above with the cover (SYSPAN-C).The labeling profile as well as the modules are fastened in a time-saving manner with self-tapping M2.5 Torx screws.Advantages:High packing density on 1 RUGreat variability due to a wide selection of front panels (e.g. for building a connection panel for media servers)Large installation depth for an easy integration of active electronicsFlexible, fast equippingSubsequently alterable and thus future-proof
19" panel for 16 x type A/B on the front and 5 x SYFB21/SYCFB21 on the back, 1 U; depth: 230 mm
$312.80*
SYSPANA5-XL
Advantages:High packing density on 1 RUGreat variability due to a wide selection of front panels (e.g. for building a connection panel for media servers)Large installation depth for an easy integration of active electronicsFlexible, fast equippingSubsequently alterable and thus future-proof
19" panel for 5 x SYFB 21 / SYCFB 21-panels for front and rear, 1HU, depth 230 mm
$299.00*
SYSPAN55-XL
The SYSPANEL5-XL allows the fast and easy construction of patch panels, device connection panels or transfer points, e.g. in control or equipment rooms.On the front and back side it can be equipped with up to up to 5 CARDINAL DVM 1 WU units (e.g. DVM-SYS-DIS, DVM-SYS-DISH, DVM-HDF4-FIBER-over-HDMI® or also SYSBOXX SYKP cassette profile), 5 SYSBOXX front panels (1 WU, SYFB21-…) or also 5 SYSBOXX connection modules (1B, SYC1-…), thus enabling the realization of modular 1 RU connection panels. The large housing depth also allows an easy integration of extender systems or format changers. The module fronts are integrated flush-mount into the housing front or back.The individual lettering can be done using our SYSBOXX labeling profile. Optionally the SYSPANEL can be closed from above with two covers (SYSPAN-C).The supplied rack brackets can be mounted in any orientation on the front or rear side of the device.The labeling profile as well as the modules are fastened in a time-saving manner with self-tapping M2.5 Torx screws.Advantages:High packing density on 1 RUGreat variability due to a wide selection of front panels for front and rear side (e.g. for building a connection panel for media servers)Large installation depth for an easy integration of active electronicsFlexible, fast equippingSubsequently alterable and thus future-proof
